- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/6584 - Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members formed by conductive elastomeric members, e.g. flat gaskets or O-rings
Patent holdings for IPC class H01R 13/6584
Total number of patents in this class: 110
10-year publication summary
|
6
|
6
|
5
|
9
|
12
|
12
|
38
|
9
|
11
|
1
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Dongguan Luxshare Technologies Co., Ltd. | 191 |
26 |
| Sumitomo Wiring Systems, Ltd. | 9367 |
9 |
| PPC Broadband, Inc. | 1017 |
6 |
| Molex, LLC | 1792 |
5 |
| Raytheon Company | 8535 |
4 |
| TE Connectivity Germany GmbH | 655 |
4 |
| Eaton Intelligent Power Limited | 6113 |
4 |
| Joinset Co., Ltd. | 47 |
3 |
| Apple Inc. | 50209 |
2 |
| Sumitomo Electric Industries, Ltd. | 14131 |
2 |
| Microsoft Technology Licensing, LLC | 51439 |
2 |
| Amphenol Corporation | 748 |
2 |
| AutoNetworks Technologies, Ltd. | 5809 |
2 |
| Carlisle Interconnect Technologies, Inc. | 139 |
2 |
| Interplex Industries, Inc. | 72 |
2 |
| Sagemcom Broadband SAS | 421 |
2 |
| International Business Machines Corporation | 60644 |
1 |
| The Boeing Company | 19843 |
1 |
| Yazaki Corporation | 6282 |
1 |
| Mediatek Inc. | 4584 |
1 |
| Other owners | 29 |